| Prototyping | Production |
Specification | | |
Rigid circuit boards | 1 | up to 48 layers |
| | |
Rigid-Flex circuit boards | Yes | + |
Metal core circuit boards | Yes | + |
High frequency circuit boards | Yes | + |
High Tg circuit boards | Yes | + |
Thick copper circuit boards | Yes | + |
| Prototyping | Production |
Options | | |
Conductor width / spacing min. | 100 µm | 75 µm |
Vias min. Ø | 200 µm | 75 µm |
Via pads min. Ø | 400 µm | 225 µm |
Via annular rings min. | 100 µm | 75 µm |
Component annular rings min. | 200 µm | 200 µm |
Blind vias min. Ø | 50 µm | 50 µm |
Buried vias min. Ø | 150 µm | 150 µm |
Press fit technology | yes | + |
Custom layer buildup | yes | + |
Sideplating | yes | + |
Half-holes | yes | + |
Tented vias | yes | + |
Plugged vias | yes | + |
Filled vias | yes | + |
Filled & capped vias | yes | + |
Copper outer layers max. | 105 µm | 450 µm |
Copper inner layers max. | 70 µm | 105 µm |
Min. thickness | 0.5 mm | 0.3 mm |
Max. thickness | 3.2 mm | 7.0 mm |
Max. size 1 or 2 layers | 10 dm² | 600 mm × 1,100 mm |
Max. size multilayer | 10 dm² | 590 mm × 1,000 mm |
Max. size Rigid-Flex | – | 560 × 400 mm |
Circuit board min. size | 15 × 15 mm | 10 × 10 mm |
| Prototyping | Production |
Surfaces | | |
Lead-free HAL | yes | + |
Lead/tin HAL | yes | + |
Copper (blank) | yes | + |
Immersion tin | yes | + |
Immersion silver | yes | + |
Immersion gold (ENIG) | yes | + |
Bonded gold, gold wire | yes | + |
Bonded gold / aluminium wire | yes | + |
ENEPIG | yes | + |
Gold-fingers | yes | + |
|
Solder-stop green | yes | + |
Solder-stop clearance min. | 75 µm | 75 µm |
Solder-stop bridge min. | 100 µm | 100 µm |
Solder-stop white | yes | + |
Solder-stop red | yes | + |
Solder-stop blue | yes | + |
Solder-stop black | yes | + |
Solder-stop coloured clearance min. | 75 µm | 75 µm |
Solder-stop coloured bridge min. | 150 µm | 150 µm |
Marking print white | yes | + |
Marking print yellow | yes | + |
Marking print black | yes | + |
Carbon print | Yes | + |
| Prototyping | Production |
Mechanical | | |
Milling min. Ø | 2 mm | 0.8 mm |
Milling special shapes | yes | + |
Inner milling | yes | + |
Z-axis milling | yes | + |
Scoring | yes | + |
| Prototyping | Production |
Materials | | |
FR4 Tg 135°C | yes | + |
FR4 HTg 180°C | yes | + |
FR4 KF (CTI 400) | yes | + |
Rogers 4350B | yes | + |
G200 | yes | + |
P97 | yes | + |
PTFE (Teflon) | yes | + |
Polyimide | yes | + |
Metal core 1 layer | yes | + |
Metal core 2 layers | yes | + |
| Prototyping | Production |
Quality controls | | |
E-Test | yes | + |
A.O.I. | yes | + |
X-ray | yes | + |
Microsection (On request) | yes | |
Impedance control | | |
(Precision up to 5% for 50 Ohms) | yes | + |
UL compliance (UL Certificate) | yes | + |
*All other specification can be verified during ordering process